The Challenge

Determining elastic and structural properties of thin conductive or dielectric layers is often:

• destructive,

• limited to single parameters, or

• dependent on complex sample preparation.

This restricts process control and material qualification.

The Patented Solution

A non-destructive measurement system using:

• interdigital transducers generating acoustic surface waves, and

• an optimization-based evaluation of frequency-dependent reflection factors.

The method enables simultaneous determination of multiple material parameters from a single measurement setup.

Key Technical Advantages

• Non-destructive characterization

• Applicable to conductive and dielectric layers

• Multi-parameter evaluation (elastic constants, density, thickness)

• Optimization-based accuracy using measured and calculated data

• Suitable for single- and multi-layer systems

Application Scope

• Thin-film characterization

• Electronic and microsystem materials

• Coating analysis and quality control

• Research and industrial measurement environments

Value for License Partners

• Enhanced material characterization capabilities

• Integration into existing measurement and testing systems

• Improved process monitoring and quality assurance

• Differentiation through patented measurement methodology

Licensing Models

• Device licensing

• Method licensing

• Application-specific licensing

Target License Partners

• Manufacturers of measurement and testing equipment
  Companies developing instruments for material, thin-film, or coating analysis.

• Suppliers of acoustic or sensor-based characterization systems
  Organizations specializing in surface acoustic wave technologies.

• Industrial electronics and microsystems companies
  Firms requiring precise, non-destructive evaluation of thin-layer materials.

• Research infrastructure and laboratory equipment providers
  Suppliers of advanced characterization tools for R&D environments.

Options for Joint Development

• Integration into existing measurement platforms
  Joint development to embed the patented method into established test systems.

• Application-specific system development
  Adaptation of the device and method to defined layer systems or materials.

• Software and evaluation co-development
  Extension of optimization algorithms for specific industrial use cases.

• Field-limited licensing with validation cooperation
  Licensing combined with joint experimental validation on application-relevant samples.